Texas Instruments Bump Development Process Engineer in Chengdu, China
Job ID 22328BR
Job Posting Title Bump Development Process Engineer
Job Description Analog is a growth area for TI. As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the Analog organization.
You will be working in CBUMP, TI's latest 300mm bump fab located in Chengdu China, responsible for developing new processes and technologies for bump integration. As part of the team, you will not only be responsible for working with both packaging and CBUMP operations on development, but you will have the opportunity to manage multiple projects giving weekly updates on project status and milestones to management. As part of the development team, you will be working with technical individuals across TI to development the latest analog technologies ensuring a successful ramp and these technologies.
Support next generation bump and WCSP designs for improved performance, cost reduction and reliability with focus on photolithography, etch and thinfilms.
Engaging with multiple internal and external stakeholders to guide and execute on technology roadmaps to support future products.
Working with individuals and teams across broad geographical and organizational boundaries.
Support of business, customer, manufacturing and quality partners
Job Opening Type Experienced Professional
Minimum Education Level Bachelor's Level Degree
Related Field(s) of Study
Minimum Years of Experience 3
Regular / Temporary Regular
Full-time / Part-time Full-Time
Job Location(s) China-Chengdu
Virtual / Telecommute No
Equal Opportunity Employer
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