Texas Instruments Senior Packaging Engineer (Die Attach Process) in Kuala Lumpur, Malaysia
Job ID 19338BR
Job Posting Title Senior Packaging Engineer (Die Attach Process)
Job Description Responsible for developing new die attach process and material for any new semiconductor package and technology. Innovates DA process technology and defines process parameters, process controls and specifications that meets manufacturability, yield, quality, reliability, cost and customer requirements for the end product. Performs integrity analysis of packages utilizing appropriate tools. Leads and coordinates the introduction of new equipment technology and new package processes into production.
Job Opening Type Experienced Professional
Minimum Education Level Bachelor's Level Degree
Related Field(s) of Study
Electrical & Computer Engineer
Electrical Eng Technology
Minimum Years of Experience 5
Regular / Temporary Regular
Full-time / Part-time Full-Time
Job Location(s) Malaysia-Kuala Lumpur
Virtual / Telecommute No
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